Bond shear testing (BST) is another test method for assessing the strength of a ball bond. This test complements, but does not substitute, wire pull testing. This is because of the existence of failure mechanisms wherein the bond exhibits a high bond shear strength but offers very little resistance to wire pull stresses.

键合金球剪切测试（BST）是另一种评价金球键合力度的方法。该方法为拉线测试的补充方法，但却不能代替拉线测试。这是因为在键合过程中表现出的失效机理在剪切测试中有较大的体现，而在拉线测试中只有较小的影响。

A bond shear tester is needed to perform the bond shear test. This equipment consists of a sample holder, a shearing arm with a chisel-shaped tool at the end, and an instrument for measuring the shear strength of the bond.

进行键合剪切测试需要有相应的设备。该设备包括：测试样品装载装置，剪切臂，剪切臂末端需有一剪切用刀头，以及可以测量剪切力度的读数装置。

Initially, the shearing tool is positioned beside the ball bond to be tested. The shearing arm then moves the tool horizontally against the ball, in effect pushing the ball off its bond pad. The force needed to shear a ball off its pad, known as the bond shear force, is then measured by the ball shear tester.

初始时，剪切刀头需位于待剪切金球的侧方。剪切刀头需水平的推向待剪切带金球，直至将金球从键合表面（bond pad）推离开。当金球被推离键合表面时代力度即为键合金球剪切力度，其应被剪切设备所记录。

The shear force reading of a ball bond must be correlated with its ball diameter for proper assessment of its ball shear strength. On the other hand, the shear force reading of a wedge bond must be correlated with the tensile strength of the wire for proper assessment of its wedge shear strength.

剪切力度应与金球直径相关（金球直径的设定应考虑到键合点需要承受的力度）。同样，在楔形线脚处的剪切力度需与金线的抗张强度相关。

The bond shear failure mode observed during bond shear testing must also be noted. Bond shear failure modes include the following: 1) bond lifting; 2) bond shearing; 3) cratering; 4) bonding surface lifting (separation of the bonding surface from its underlying substrate). Misplacement of the shearing tool produces invalid bond shear failures, the shear force readings of which must be excluded from analysis.

金球剪切失效模式同样需要被记录，为如下之一，1）金球掀起，2）金球被推离，3）火山口（金球被推离表面，带起芯片表面，导致芯片材料-硅显露出来，形成火山口一样的凹坑——NovHeaven），4）键合表面分离（键合表面与芯片材料之间的分离）。因剪切刀头放置位置错误而产生的读数是无效的，不应供分析使用。

以上英文内容来自网站：www.siliconfareast.com，中文翻译出自NovHeaven。

剪切测试一般用于半导体封装流程的前段，其为监控生产能力与稳定性的重要标准之一，一般为SPC测试中的重要一项。

剪切测试相关国际标准：EIA/JESD22-B116 （该标准为互联网免费共享，无需购买）。