产品信息(性能描述 优势 应用范围)

英文说明

产品信息

性能描述

专利设计，适用于所有梅兰日兰超五类和六类屏蔽及非屏蔽信息模块以及七类MiniC信息模块；相比较传统打线方式，此压接方式更加轻松；

工具上的TIA/EIA568A和568B的线序图标设计一目了然，操作更方便；

体积小巧，便于携带。

优势

质量可靠，体积小巧，使用简单，携带方便。

应用范围

适用于所有梅兰日兰超五类和六类屏蔽及非屏蔽信息模块以及七类MiniC信息模块。

英文说明

Performance Description

Patented design, applicable to all MGE five and six ultra-shielded and unshielded information module and seven types of MiniC information module;

Compared to conventional wire bonding method, this method easier crimping;

Tools on line order TIA/EIA568A and 568B icon design at a glance, the operation more convenient;

Compact, easy to carry.

Superiority

Reliable, compact, simple to use, easy to carry.

Applications

Apply to all MGE five and six ultra-shielded and unshielded information module and seven types of MiniC information module.